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Parvus3D

HT-200

Photopolymeric Resin

HT-200 stands as a robust high-temperature material, engineered to endure conditions up to 200°C. Its formidable strength and lasting durability make it an exemplary choice for final product applications where reliability under heat is a necessity.

HT-200 material testing dogbone

HT-200 3d Printing Material Properties

HT-200 Design Guidelines

Our Most Temperature Resistant Material

Maximum Part Size

S230 (2µm): 40x40x50mm
S240 (10µm): 100x100x75mm

X-Y Resolution

S230 (2µm): 2µm
S240 (10µm): 10µm

Z Resolution

S230 (2µm): 5 – 20µm
S240 (10µm): 10 - 40µm

Surface Finish

0.4-0.8 µm Ra (Top) 1.5-2.5 µm Ra (Side)

Minimum Vertical Hole Diameter

S230 (2µm): 10µm
S240 (10µm): 40µm

Minimum Horizontal Hole Diameter

S230 (2µm): 50µm
S240 (10µm): 100µm

Maximum Bridged Overhang Length

S230 (2µm): 500µm
S240 (10µm): 1500µm

Maximum Unbridged Overhang Length

S230 (2µm): 100µm
S240 (10µm): 300µm

Minimum Unsupported Overhang

S230 (2µm): 30°
S240 (10µm): 30°

Minimum Wall Thickness

S230 (2µm): 50µm
S240 (10µm): 50µm

Maximum Aspect Ratio for Channels

S230 (2µm): 500:1
S240 (10µm): 100:1

Maximum Aspect Ratio for Pins

S230 (2µm): 50:1
S240 (10µm): 40:1

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